Symwave ( designer of first silicon chip for USB 3.0) is developing a array of SuperSpeed USB3.0 compatible products operating at 10 times the speed of current USB operated devices. Its main focus is on external storage, cell phones, media players, camcorders and digital cameras. As the data storage requirements are increasing exponentially , there’s a need for high-speed data transfer channels. Symwave USB 3.0 will bring RAID technology to external drives which is practically impossible with 2.0 channel because just one SATA drive can saturate USB connection. RAID (Redundant Array of Inexpensive Disks) technology divides and replicates data among multiple hard disk drives. Not only that; USB 3.0 will make it easier to power portable RAID drives, power faster spinning HHDs and charge Smartphones and other devices.
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